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WebMar 24, 2024 · A new technical paper titled “DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design” was published (preprint) by researchers at UCSB and Cadence. Abstract “Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. WebDownload files and build them with your 3D printer, laser cutter, or CNC. Thingiverse is a universe of things. grassy mountain mine oregon
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